6 Izendlalelo FR4 HDI PCB Circuit in 2oz copper with Immersion Tin Surface Iqedile
Ulwazi Oluyisisekelo
| Imodeli No. | I-PCB-A12 |
| Iphakethe lezokuthutha | Ukupakisha Vacuum |
| Isitifiketi | UL, ISO9001&ISO14001,RoHS |
| Isicelo | Ama-electronics wabathengi |
| Ubuncane beSikhala/Ulayini | 0.075mm/3mil |
| Amandla Okukhiqiza | 50,000 sqm/ngenyanga |
| Ikhodi ye-HS | 853400900 |
| Umsuka | Kwenziwe eshayina |
Incazelo Yomkhiqizo
Isingeniso se-HDI PCB
I-HDI PCB ichazwa njengebhodi lesifunda eliphrintiwe elinokuminyana kwezintambo okuphezulu endaweni yeyunithi kune-PCB evamile.Zinemigqa nezikhala ezicolekileyo kakhulu, ama-vias amancane namaphedi wokuthwebula, kanye nokuminyana kwephedi yokuxhumana ephakeme kunaleyo esetshenziswa kubuchwepheshe obuvamile be-PCB.Ama-PCB we-HDI enziwa ngama-microvias, ama-vias angcwatshwe kanye ne-lamination elandelanayo ngezinto zokufakwa ngaphakathi kanye ne-conductor wiring ukuze kube nokuminyana okuphezulu kwemizila.
Izinhlelo zokusebenza
I-HDI PCB isetshenziselwa ukunciphisa usayizi nesisindo, kanye nokuthuthukisa ukusebenza kukagesi kwedivayisi.I-HDI PCB iyindlela engcono kakhulu yokubala ungqimba oluphezulu kanye nenani elibizayo le-laminate elijwayelekile noma amabhodi alamiwe ngokulandelana kwawo.I-HDI ihlanganisa izindlela ezingaboni futhi ezingcwatshiwe ezisiza ukulondoloza izindlu ezithengiswayo ze-PCB ngokuvumela izici nemigqa ukuthi yakhelwe ngaphezulu noma ngaphansi kwayo ngaphandle kokuxhumana.Iningi lanamuhla lephimbo elihle le-BGA kanye nezinyathelo zengxenye ye-flip-chip azikuvumeli ukulandela umkhondo phakathi kwamaphedi e-BGA.I-vias eyimpumputhe nengcwatshiwe izoxhuma kuphela izendlalelo ezidinga ukuxhumeka kuleyo ndawo.
Ezobuchwepheshe nekhono
| Into | Amandla Okukhiqiza |
| Izibalo Zesendlalelo | 1-20 izingqimba |
| Okubalulekile | FR-4, CEM-1/CEM-3, PI, High Tg, Rogers, PTEF, Alu/Cu Base, njll. |
| Ukujiya kwebhodi | 0.10mm-8.00mm |
| Usayizi Omkhulu | 600mmX1200mm |
| Ukubekezelela Kohlaka Lwebhodi | +0.10mm |
| Ukubekezelela Ukuqina(t≥0.8mm) | ±8% |
| Ukubekezelela Ukuqina(t<0.8mm) | ±10% |
| I-Insulation Layer Thickness | 0.075mm-5.00mm |
| Ubuncane Ulayini | 0.075mm |
| Ubuncane besikhala | 0.075mm |
| Out Layer Copper Ukuqina | 18um--350um |
| Ungqimba Lwangaphakathi Ukuqina Kwethusi | 17um--175um |
| Imbobo Yokubhoboza(Mechanical) | 0.15mm-6.35mm |
| Qedela Imbobo(Mechanical) | 0.10mm-6.30mm |
| Ukubekezelela Idayamitha(Mechanical) | 0.05mm |
| Ukubhalisa(Okomshini) | 0.075mm |
| I-Aspect ratio | 16:1 |
| Uhlobo Lwemaski Solder | I-LPI |
| I-SMT Mini.Solder Mask Width | 0.075mm |
| Okuncane.I-Solder Mask Clearance | 0.05mm |
| I-Plug Hole Diameter | 0.25mm--0.60mm |
| Ukulawula Impedans Ukubekezelelana | ±10% |
| Ukuphela kwendawo/ukwelashwa | HASL, ENIG, Chem, Tin, Flash Gold, OSP, Gold Finger |
Inqubo Yokukhiqiza ye-PCB
Inqubo iqala ngokuklama Isakhiwo se-PCB usebenzisa noma iyiphi isofthiwe yokuklama ye-PCB / Ithuluzi le-CAD (i-Proteus, Ukhozi, Noma i-CAD).
Zonke ezinye izinyathelo ezeNqubo Yokukhiqiza Yebhodi Lesifunda Eliphrintiwe Eliqinile liyafana ne-Single Sided PCB noma i-Double Sided PCB noma i-Multi-layer PCB.
Isikhathi sokuhola se-Q/T
| Isigaba | Isikhathi Esisheshayo Sokuhola | Isikhathi Esijwayelekile Sokuhola |
| Izinhlangothi ezimbili | Amahora angu-24 | Amahora angu-120 |
| 4 Izendlalelo | amahora 48 | 172 amahora |
| 6 Izendlalelo | 72 amahora | 192 amahora |
| 8 Izendlalelo | 96 amahora | Amahora angu-212 |
| 10 Izendlalelo | Amahora angu-120 | amahora 268 |
| 12 Izendlalelo | Amahora angu-120 | amahora angu-280 |
| 14 Izendlalelo | 144 amahora | amahora 292 |
| 16-20 Izendlalelo | Kuya ngezidingo ezithile | |
| Ngaphezulu kwezingqimba ezingama-20 | Kuya ngezidingo ezithile | |
Umnyakazo we-ABIS wokulawula i-FR4 PCBS
Ukulungiselela Imbobo
Ukukhipha imfucumfucu ngokucophelela nokulungisa amapharamitha womshini wokubhoboza: ngaphambi kokucwenga ngethusi, i-ABIS inaka kakhulu zonke izimbobo ku-FR4 PCB ephathwayo ukuze kukhishwe udoti, ukungalungi kwendawo, kanye ne-epoxy smear, izimbobo ezihlanzekile ziqinisekisa ukuthi ukunamathela kunamathela ngempumelelo ezindongeni zembobo. .futhi, ekuqaleni kwenqubo, imingcele yomshini wokubhoboza ilungiswa ngokunembile.
Ukulungiswa kwendawo
Ukukhipha imali ngokucophelela: abasebenzi bethu bezobuchwepheshe abanolwazi bazoqaphela kusenesikhathi ukuthi ukuphela kwendlela yokugwema umphumela omubi ukulindela isidingo sokuphatha okukhethekile nokuthatha izinyathelo ezifanele zokuqinisekisa ukuthi inqubo yenziwa ngokucophelela nangendlela efanele.
Amazinga Wokunweba Okushisayo
Njengoba ijwayele ukubhekana nezinto ezihlukahlukene, i-ABIS izokwazi ukuhlaziya inhlanganisela ukuze iqiniseke ukuthi ifanelekile.bese ugcina ukwethembeka kwesikhathi eside kwe-CTE (i-coefficient of thermal expansion), ne-CTE ephansi, mancane amathuba okuthi ukugqitshwa ngezimbobo kungaphumeleli ekuguquguqukeni okuphindaphindiwe kwethusi okwakha ukuxhumana kongqimba lwangaphakathi.
Ukukala
Ukulawula i-ABIS ukujikeleza kukhushulwa ngamaphesenti aziwayo ngokulindela lokhu kulahlekelwa ukuze izendlalelo zizobuyela kubukhulu bazo obuklanywe njengobuklanywe ngemva kokuqedwa komjikelezo wokulambisa.futhi, kusetshenziswa izincomo zokukala eziyisisekelo zomenzi we-laminate ngokuhambisana nedatha yokulawula inqubo yezibalo yasendlini, ukudayela izici zesikali ezizohambisana ngokuhamba kwesikhathi kuleyo ndawo yokukhiqiza.
Ukwenza imishini
Uma kufika isikhathi sokwakha i-PCB yakho, i-ABIS qiniseka ukuthi oyikhethayo inemishini efanele nolwazi lokuyikhiqiza
I-ABIS Quality Mission
Izinga lokuphasa lezinto ezingenayo ezingaphezu kuka-99.9%, inani lamazinga okunqatshwa kwenqwaba angaphansi kuka-0.01%.
Izikhungo eziqinisekisiwe ze-ABIS zilawula zonke izinqubo ezibalulekile ukuze kuqedwe zonke izinkinga ezingase zibe khona ngaphambi kokukhiqiza.
I-ABIS isebenzisa isofthiwe ethuthukisiwe ukwenza ukuhlaziya okubanzi kwe-DFM kudatha engenayo, futhi isebenzisa izinhlelo ezithuthukisiwe zokulawula ikhwalithi kuyo yonke inqubo yokukhiqiza.
I-ABIS yenza ukuhlola okubonwayo kanye ne-AOI okungu-100% kanye nokwenza ukuhlola kukagesi, ukuhlola amandla kagesi aphezulu, ukuhlola isilawuli se-impedance, ukuhlukanisa izingxenye ezincane, ukuhlola ukushaqeka kwe-thermal, ukuhlola i-solder, ukuhlola ukwethembeka, ukuhlola ukumelana nokuvikela kanye nokuhlola ukuhlanzeka kwe-ionic.
Isitifiketi
FAQ
Iningi labo livela kwa-Shengyi Technology Co., Ltd. (SYTECH), obe ngumkhiqizi we-CCL wesibili ngobukhulu emhlabeni ngokuya ngevolumu yokuthengisa, kusukela ngo-2013 kuya ku-2017. Sakha ubudlelwano besikhathi eside bokubambisana kusukela ngo-2006. I-FR4 resin material (Imodeli S1000-2, S1141, S1165, S1600) isetshenziselwa kakhulu ukwenza amabhodi wesifunda aphrintiwe anezinhlangothi ezimbili kanye namabhodi anezingqimba eziningi.Nansi imininingwane yereferensi yakho.
Ku-FR-4: I-Sheng Yi, Ibhodi Lenkosi, i-Nan Ya, i-Polycard, i-ITEQ, i-ISOLA
Ku-CEM-1 & CEM 3: I-Sheng Yi, Ibhodi Lenkosi
Okwemvamisa ephezulu : Sheng Yi
Okokwelapha kwe-UV: i-Tamura, i-Chang Xing ( * Umbala otholakalayo: Oluhlaza) I-Solder yohlangothi olulodwa
Ngesithombe Soketshezi: Tao Yang, Resist (Ifilimu Emanzi)
I-Chuan Yu ( * Imibala etholakalayo : Emhlophe, Ephuzi Oyicabange Kayo, Ensomi, Ebomvu, Eluhlaza okwesibhakabhaka, Eluhlaza, Emnyama)
),1 Ihora elicashuniwe
b), amahora ama-2 wempendulo yesikhalazo
c), 7*24 amahora ukwesekwa lobuchwepheshe
d), 7*24 isevisi ye-oda
e), ukulethwa kwamahora angu-7*24
f), 7*24 ukuqhutshwa kokukhiqiza
Cha, asikwazi ukwamukela amafayela ezithombe, uma ungenalo ifayela le-Gerber, ungasithumelela isampula ukuze silikopishe.
Inqubo yokukopisha ye-PCB&PCBA:
Izinqubo Zethu Zokuqinisekisa Ikhwalithi njengoba ngezansi:
a), Ukuhlola Okubonwayo
b), I-Flying probe, ithuluzi lokulungisa
c), Ukulawulwa kokuphazamiseka
d), ukutholwa kwekhono le-Solder
e), Isibonakhulu se-Digital metallo graphic
f), i-AOI (Ukuhlola okuzenzakalelayo kokubona)
Ihlolwe phakathi namahora angu-12.Uma umbuzo kanjiniyela kanye nefayela elisebenzayo selihloliwe, sizoqala ukukhiqiza.
Bheka eduze kwakho.Imikhiqizo eminingi kangaka ivela eChina.Ngokusobala, lokhu kunezizathu eziningana.Akuseyona nje intengo.
Ukulungiselela izingcaphuno kwenziwa ngokushesha.
Ama-oda okukhiqiza aqedwa ngokushesha.Ungahlela ama-oda ahlelelwe izinyanga kusengaphambili, singawahlela ngokushesha uma i-PO isiqinisekisile.
Uchungechunge lokunikezela lunwetshwe kakhulu.Yingakho singakwazi ukuthenga yonke ingxenye kozakwethu okhethekile ngokushesha okukhulu.
Abasebenzi abaguquguqukayo nabanothando.Ngenxa yalokho, samukela yonke i-oda.
24 isevisi ye-inthanethi yezidingo eziphuthumayo.Amahora okusebenza angu-+10 amahora ngosuku.
Izindleko eziphansi.Azikho izindleko ezifihliwe.Yonga kubasebenzi, ngaphezulu kanye nempahla.
I-ABIS ayinazo izidingo ze-MOQ ze-PCB noma i-PCBA.
I-ABlS yenza ukuhlola okubonwayo kanye ne-AOl okungu-100% kanye nokwenza ukuhlola kukagesi, ukuhlola amandla kagesi aphezulu, ukuhlola isilawuli se-impedance, ukuhlukanisa izingxenye ezincane, ukuhlola ukushaqeka kwe-thermal, ukuhlola i-solder, ukuhlola ukwethembeka, ukuhlola ukumelana nokuvikela, ukuhlola ukuhlanzeka kwe-ionic kanye nokuhlola okusebenzayo kwe-PCBA.
I-ABIS ayinazo izidingo ze-MOQ ze-PCB noma i-PCBA.
| Amandla okukhiqiza wemikhiqizo edayiswayo eshisayo | |
| I-Double Side/Multilayer PCB Workshop | I-Aluminium PCB Workshop |
| Amandla Obuchwepheshe | Amandla Obuchwepheshe |
| Izinto ezisetshenziswayo: CEM-1, CEM-3, FR-4(High TG), Rogers, TELFON | Izinto ezisetshenziswayo: Isisekelo se-Aluminium, isisekelo sethusi |
| Isendlalelo: Isendlalelo esingu-1 kuye kwezingu-20 | Isendlalelo: Isendlalelo esingu-1 kanye Nezendlalelo ezi-2 |
| Ububanzi/isikhala somugqa omncane: 3mil/3mil(0.075mm/0.075mm) | Ububanzi/isikhala somugqa omncane: 4mil/4mil(0.1mm/0.1mm) |
| Usayizi we-Min.Hole: 0.1mm(imbobo yokubhoboza) | Okuncane.Usayizi wembobo: 12mil(0.3mm) |
| Ubukhulu.Usayizi webhodi: 1200mm* 600mm | Usayizi webhodi eliphezulu: 1200mm* 560mm(47in* 22in) |
| Ugqinsi lwebhodi eliqediwe: 0.2mm-6.0mm | Ugqinsi lwebhodi eliqediwe: 0.3 ~ 5mm |
| Ubukhulu be-foil yethusi: 18um~280um(0.5oz~8oz) | Ubukhulu be-foil yethusi: 35um~210um(1oz~6oz) |
| I-NPTH Hole Ukubekezelela: +/-0.075mm, PTH Ukubekezelela Imbobo: +/-0.05mm | Ukubekezelela isikhundla sembobo: +/-0.05mm |
| Ukubekezelela Kohlaka: +/-0.13mm | Ukubekezelela kohlaka lomzila: +/ 0.15mm;ukubekezelela kohlaka lokubhoboza:+/ 0.1mm |
| Indawo engaphezulu iqediwe: I-HASL engenamthofu, igolide lokucwiliswa (ENIG), isiliva lokucwiliswa, i-OSP, ucwecwe lwegolide, umunwe wegolide, I-Carbon INK. | Ubuso buqediwe: I-HASL yamahhala yokuhola, igolide lokucwiliswa (ENIG), isiliva lokucwiliswa, i-OSP njll |
| Ukubekezelelwa kokulawulwa kokuphazamiseka: +/-10% | Hlala ukubekezelela ukujiya: +/-0.1mm |
| Amandla okukhiqiza: 50,000 sqm/ngenyanga | I-MC PCB Amandla okukhiqiza: 10,000 sqm/ngenyanga |
