6 Ibhodi le-PCB Eqinile Yegolide enogqinsi lwebhodi elingu-3.2mm kanye ne-Counter Sink Hole
Ulwazi Oluyisisekelo
| Imodeli No. | I-PCB-A37 |
| Iphakethe lezokuthutha | Ukupakisha Vacuum |
| Isitifiketi | UL, ISO9001&ISO14001,RoHS |
| Isicelo | Ama-electronics wabathengi |
| Ubuncane beSikhala/Ulayini | 0.075mm/3mil |
| Amandla Okukhiqiza | 50,000 sqm/ngenyanga |
| Ikhodi ye-HS | 853400900 |
| Umsuka | Kwenziwe eshayina |
Incazelo Yomkhiqizo
Isingeniso se-HDI PCB
I-HDI PCB ichazwa njengebhodi lesifunda eliphrintiwe elinokuminyana kwezintambo okuphezulu endaweni yeyunithi kune-PCB evamile.Zinemigqa nezikhala ezicolekileyo kakhulu, ama-vias amancane namaphedi wokuthwebula, kanye nokuminyana kwephedi yokuxhumana ephakeme kunaleyo esetshenziswa kubuchwepheshe obuvamile be-PCB.Ama-PCB we-HDI enziwa ngama-microvias, ama-vias angcwatshwe kanye ne-lamination elandelanayo ngezinto zokufakwa ngaphakathi kanye ne-conductor wiring ukuze kube nokuminyana okuphezulu kwemizila.
Izinhlelo zokusebenza
I-HDI PCB isetshenziselwa ukunciphisa usayizi nesisindo, kanye nokuthuthukisa ukusebenza kukagesi kwedivayisi.I-HDI PCB iyindlela engcono kakhulu yokubala ungqimba oluphezulu kanye nenani elibizayo le-laminate elijwayelekile noma amabhodi alamiwe ngokulandelana kwawo.I-HDI ihlanganisa izindlela ezingaboni futhi ezingcwatshiwe ezisiza ukulondoloza izindlu ezithengiswayo ze-PCB ngokuvumela izici nemigqa ukuthi yakhelwe ngaphezulu noma ngaphansi kwayo ngaphandle kokuxhumana.Iningi lanamuhla lephimbo elihle le-BGA kanye nezinyathelo zengxenye ye-flip-chip azikuvumeli ukulandela umkhondo phakathi kwamaphedi e-BGA.I-vias eyimpumputhe nengcwatshiwe izoxhuma kuphela izendlalelo ezidinga ukuxhumeka kuleyo ndawo.
Ezobuchwepheshe nekhono
| INTO | AMAKHONO | INTO | AMAKHONO |
| Izendlalelo | 1-20L | I-Copper Eminyene | 1-6OZ |
| Uhlobo Lwemikhiqizo | Ibhodi le-HF(High-frequency) &(Radio Frequency), ibhodi elilawulwa yi-Imedance, HDIboard, BGA & Fine Pitch board | I-Solder Mask | I-Nanya & Taiyo;I-LRI & Matt Red.oluhlaza, ophuzi, omhlophe, oluhlaza okwesibhakabhaka, omnyama |
| Izinto eziyisisekelo | FR4(Shengyi China,ITEQ, KB A+,HZ),HITG,FrO6,Rogers,Taconic,Argon,Nalco lsola njalonjalo | I-Surface eqediwe | I-HASL evamile,i-HASL engenamthofu,iFlashGold,ENIG (lmmersion Gold) OSP (Entek),lmmersion TiN, lmmersion Silver,Hard Gold |
| Ukwelashwa okukhethiwe kobuso | I-ENIG(igolide lokucwiliswa) + OSP, ENIG(igolide lokucwiliswa) + Umunwe Wegolide, Umunwe Wegolide Okhanyayo, ukucwiliswaOkuPhila + Umunwe Wegolide, Ithini Lokucwiliswa + Umunwe Wegolide | ||
| Ukucaciswa Kwezobuchwepheshe | Ubuncane bobubanzi/igebe lomugqa: 3.5/4mil (i-laser dril) Ubuncane bosayizi wembobo: 0.15 mm(i-mechanical drill/4 mill laser drill) Ubuncane Bendandatho Yonyaka: 4mil Ubukhulu be-Copper: 6Oz Ubukhulu bokukhiqiza: 600x1200mm Ubukhulu bebhodi: D/S: 0.2-70mm,Ama-Mulltilayer: 0.40-7.Omm I-Min Solder Mask Bridge: ≥0.08mm Ukubukeka kwesilinganiso: 15:1 Ukuxhuma ngekhono: 0.2-0.8mm | ||
| Ukubekezelelana | Ukubekezelela kwezimbobo eziplathiwe : ±0.08mm(min±0.05) Ukubekezelela imbobo engagcwali: ±O.05min(min+O/-005mm noma +0.05/Omm) Ukubekezelela Uhlaka: ±0.15min(min±0.10mm) Ukuhlolwa okusebenzayo: Ukumelana nokuvikela: 50 ohms (okujwayelekile) Susa amandla: 14N/mm Ukuhlolwa kwe-Thermal Stress: 265C.20 imizuzwana Ubulukhuni bemaski ye-solder: 6H I-E-test voltage: 50ov±15/-0V 3os I-Warp and Twist: 0.7%( ibhodi lokuhlola le-semiconductor 0.3%) | ||
Izici-Inzuzo Yemikhiqizo Yethu
Umkhiqizi wesipiliyoni seminyaka engaphezu kwe-15 emkhakheni wenkonzo we-PCB
Isilinganiso esikhulu sokukhiqiza siqinisekisa ukuthi izindleko zakho zokuthenga ziphansi.
Ulayini wokukhiqiza oseqophelweni eliphezulu uqinisekisa ikhwalithi ezinzile nempilo ende
Ukuhlolwa okungu-100% kwayo yonke imikhiqizo eyenziwe ngezifiso ye-PCB
Isevisi ye-One-stop, singasiza ekuthengeni izingxenye
Isikhathi sokuhola se-Q/T
| Isigaba | Isikhathi Esisheshayo Sokuhola | Isikhathi Esijwayelekile Sokuhola |
| Izinhlangothi ezimbili | Amahora angu-24 | Amahora angu-120 |
| 4 Izendlalelo | amahora 48 | 172 amahora |
| 6 Izendlalelo | 72 amahora | 192 amahora |
| 8 Izendlalelo | 96 amahora | Amahora angu-212 |
| 10 Izendlalelo | Amahora angu-120 | amahora 268 |
| 12 Izendlalelo | Amahora angu-120 | amahora angu-280 |
| 14 Izendlalelo | 144 amahora | amahora 292 |
| 16-20 Izendlalelo | Kuya ngezidingo ezithile | |
| Ngaphezulu kwezingqimba ezingama-20 | Kuya ngezidingo ezithile | |
Umnyakazo we-ABIS wokulawula i-FR4 PCBS
Ukulungiselela Imbobo
Ukukhipha imfucumfucu ngokucophelela nokulungisa amapharamitha womshini wokubhoboza: ngaphambi kokucwenga ngethusi, i-ABIS inaka kakhulu zonke izimbobo ku-FR4 PCB ephathwayo ukuze kukhishwe udoti, ukungalungi kwendawo, kanye ne-epoxy smear, izimbobo ezihlanzekile ziqinisekisa ukuthi ukunamathela kunamathela ngempumelelo ezindongeni zembobo. .futhi, ekuqaleni kwenqubo, imingcele yomshini wokubhoboza ilungiswa ngokunembile.
Ukulungiswa kwendawo
Ukukhipha imali ngokucophelela: abasebenzi bethu bezobuchwepheshe abanolwazi bazoqaphela kusenesikhathi ukuthi ukuphela kwendlela yokugwema umphumela omubi ukulindela isidingo sokuphatha okukhethekile nokuthatha izinyathelo ezifanele zokuqinisekisa ukuthi inqubo yenziwa ngokucophelela nangendlela efanele.
Amazinga Wokunweba Okushisayo
Njengoba ijwayele ukubhekana nezinto ezihlukahlukene, i-ABIS izokwazi ukuhlaziya inhlanganisela ukuze iqiniseke ukuthi ifanelekile.bese ugcina ukwethembeka kwesikhathi eside kwe-CTE (i-coefficient of thermal expansion), ne-CTE ephansi, mancane amathuba okuthi ukugqitshwa ngezimbobo kungaphumeleli ekuguquguqukeni okuphindaphindiwe kwethusi okwakha ukuxhumana kongqimba lwangaphakathi.
Ukukala
Ukulawula i-ABIS ukujikeleza kukhushulwa ngamaphesenti aziwayo ngokulindela lokhu kulahlekelwa ukuze izendlalelo zizobuyela kubukhulu bazo obuklanywe njengobuklanywe ngemva kokuqedwa komjikelezo wokulambisa.futhi, kusetshenziswa izincomo zokukala eziyisisekelo zomenzi we-laminate ngokuhambisana nedatha yokulawula inqubo yezibalo yasendlini, ukudayela izici zesikali ezizohambisana ngokuhamba kwesikhathi kuleyo ndawo yokukhiqiza.
Ukwenza imishini
Uma kufika isikhathi sokwakha i-PCB yakho, i-ABIS qiniseka ukuthi oyikhethayo inemishini efanele nolwazi lokuyikhiqiza
I-ABIS Quality Mission
Izinga lokuphasa lezinto ezingenayo ezingaphezu kuka-99.9%, inani lamazinga okunqatshwa kwenqwaba angaphansi kuka-0.01%.
Izikhungo eziqinisekisiwe ze-ABIS zilawula zonke izinqubo ezibalulekile ukuze kuqedwe zonke izinkinga ezingase zibe khona ngaphambi kokukhiqiza.
I-ABIS isebenzisa isofthiwe ethuthukisiwe ukwenza ukuhlaziya okubanzi kwe-DFM kudatha engenayo, futhi isebenzisa izinhlelo ezithuthukisiwe zokulawula ikhwalithi kuyo yonke inqubo yokukhiqiza.
I-ABIS yenza ukuhlola okubonwayo kanye ne-AOI okungu-100% kanye nokwenza ukuhlola kukagesi, ukuhlola amandla kagesi aphezulu, ukuhlola isilawuli se-impedance, ukuhlukanisa izingxenye ezincane, ukuhlola ukushaqeka kwe-thermal, ukuhlola i-solder, ukuhlola ukwethembeka, ukuhlola ukumelana nokuvikela kanye nokuhlola ukuhlanzeka kwe-ionic.
Isitifiketi
FAQ
Iningi labo livela kwa-Shengyi Technology Co., Ltd. (SYTECH), obe ngumkhiqizi we-CCL wesibili ngobukhulu emhlabeni ngokuya ngevolumu yokuthengisa, kusukela ngo-2013 kuya ku-2017. Sakha ubudlelwano besikhathi eside bokubambisana kusukela ngo-2006. I-FR4 resin material (Imodeli S1000-2, S1141, S1165, S1600) isetshenziselwa kakhulu ukwenza amabhodi wesifunda aphrintiwe anezinhlangothi ezimbili kanye namabhodi anezingqimba eziningi.Nansi imininingwane yereferensi yakho.
Ku-FR-4: I-Sheng Yi, Ibhodi Lenkosi, i-Nan Ya, i-Polycard, i-ITEQ, i-ISOLA
Ku-CEM-1 & CEM 3: I-Sheng Yi, Ibhodi Lenkosi
Okwemvamisa ephezulu : Sheng Yi
Okokwelapha kwe-UV: i-Tamura, i-Chang Xing ( * Umbala otholakalayo: Oluhlaza) I-Solder yohlangothi olulodwa
Ngesithombe Soketshezi: Tao Yang, Resist (Ifilimu Emanzi)
I-Chuan Yu ( * Imibala etholakalayo : Emhlophe, Ephuzi Oyicabange Kayo, Ensomi, Ebomvu, Eluhlaza okwesibhakabhaka, Eluhlaza, Emnyama)
),1 Ihora elicashuniwe
b), amahora ama-2 wempendulo yesikhalazo
c), 7*24 amahora ukwesekwa lobuchwepheshe
d), 7*24 isevisi ye-oda
e), ukulethwa kwamahora angu-7*24
f), 7*24 ukuqhutshwa kokukhiqiza
Cha, asikwazi ukwamukela amafayela ezithombe, uma ungenalo ifayela le-Gerber, ungasithumelela isampula ukuze silikopishe.
Inqubo yokukopisha ye-PCB&PCBA:
Izinqubo Zethu Zokuqinisekisa Ikhwalithi njengoba ngezansi:
a), Ukuhlola Okubonwayo
b), I-Flying probe, ithuluzi lokulungisa
c), Ukulawulwa kokuphazamiseka
d), ukutholwa kwekhono le-Solder
e), Isibonakhulu se-Digital metallo graphic
f), i-AOI (Ukuhlola okuzenzakalelayo kokubona)
Izinga lokulethwa ngesikhathi lingaphezu kwama-95%
a), ukujika okusheshayo kwamahora angama-24 kwe-PCB eseceleni okukabili
b), 48hours for 4-8 izendlalelo prototype PCB
c), ihora elingu-1 lekhotheshini
d), amahora angu-2 ombuzo kanjiniyela/impendulo yesikhalazo
e), Amahora angu-7-24 wokusekelwa kobuchwepheshe/isevisi yoku-oda/imisebenzi yokukhiqiza
I-ABIS ayinazo izidingo ze-MOQ ze-PCB noma i-PCBA.
I-ABlS yenza ukuhlola okubonwayo kanye ne-AOl okungu-100% kanye nokwenza ukuhlola kukagesi, ukuhlola amandla kagesi aphezulu, ukuhlola isilawuli se-impedance, ukuhlukanisa izingxenye ezincane, ukuhlola ukushaqeka kwe-thermal, ukuhlola i-solder, ukuhlola ukwethembeka, ukuhlola ukumelana nokuvikela, ukuhlola ukuhlanzeka kwe-ionic kanye nokuhlola okusebenzayo kwe-PCBA.
Izimboni Eziyinhloko ze-ABIS: Ukulawulwa Kwezimboni, Ezokuxhumana, Imikhiqizo Yezimoto kanye Nezokwelapha.Imakethe Eyinhloko ye-ABIS: 90% Imakethe Yamazwe Ngamazwe (40% -50% yase-USA, 35% yase-Europe, 5% yaseRussia kanye ne-5% -10% yaseMpumalanga Asia) kanye ne-10% Yemakethe Yasekhaya.
| Amandla okukhiqiza wemikhiqizo edayiswayo eshisayo | |
| I-Double Side/Multilayer PCB Workshop | I-Aluminium PCB Workshop |
| Amandla Obuchwepheshe | Amandla Obuchwepheshe |
| Izinto ezisetshenziswayo: CEM-1, CEM-3, FR-4(High TG), Rogers, TELFON | Izinto ezisetshenziswayo: Isisekelo se-Aluminium, isisekelo sethusi |
| Isendlalelo: Isendlalelo esingu-1 kuye kwezingu-20 | Isendlalelo: Isendlalelo esingu-1 kanye Nezendlalelo ezi-2 |
| Ububanzi/isikhala somugqa omncane: 3mil/3mil(0.075mm/0.075mm) | Ububanzi/isikhala somugqa omncane: 4mil/4mil(0.1mm/0.1mm) |
| Usayizi we-Min.Hole: 0.1mm(imbobo yokubhoboza) | Okuncane.Usayizi wembobo: 12mil(0.3mm) |
| Ubukhulu.Usayizi webhodi: 1200mm* 600mm | Usayizi webhodi eliphezulu: 1200mm* 560mm(47in* 22in) |
| Ugqinsi lwebhodi eliqediwe: 0.2mm-6.0mm | Ugqinsi lwebhodi eliqediwe: 0.3 ~ 5mm |
| Ubukhulu be-foil yethusi: 18um~280um(0.5oz~8oz) | Ubukhulu be-foil yethusi: 35um~210um(1oz~6oz) |
| I-NPTH Hole Ukubekezelela: +/-0.075mm, PTH Ukubekezelela Imbobo: +/-0.05mm | Ukubekezelela isikhundla sembobo: +/-0.05mm |
| Ukubekezelela Kohlaka: +/-0.13mm | Ukubekezelela kohlaka lomzila: +/ 0.15mm;ukubekezelela kohlaka lokubhoboza:+/ 0.1mm |
| Indawo engaphezulu iqediwe: I-HASL engenamthofu, igolide lokucwiliswa (ENIG), isiliva lokucwiliswa, i-OSP, ucwecwe lwegolide, umunwe wegolide, I-Carbon INK. | Ubuso buqediwe: I-HASL yamahhala yokuhola, igolide lokucwiliswa (ENIG), isiliva lokucwiliswa, i-OSP njll |
| Ukubekezelelwa kokulawulwa kokuphazamiseka: +/-10% | Hlala ukubekezelela ukujiya: +/-0.1mm |
| Amandla okukhiqiza: 50,000 sqm/ngenyanga | I-MC PCB Amandla okukhiqiza: 10,000 sqm/ngenyanga |
