Ibhodi Lokulawula Ukufinyelela Kwenethiwekhi PCB Isilawuli PCBA Board for Telecommunication Industry
Ulwazi lokukhiqiza
| Imodeli No. | I-PCB-A44 |
| Indlela yokuhlanganisa | I-SMT |
| Iphakethe lezokuthutha | I-Anti-static Packaging |
| Isitifiketi | UL, ISO9001&14001, SGS, RoHS, Ts16949 |
| Izincazelo | IPC Ikilasi 2 |
| Ubuncane beSikhala/Ulayini | 0.075mm/3mil |
| Isicelo | Ukuxhumana |
| Umsuka | Kwenziwe eshayina |
| Amandla Okukhiqiza | 720,000 M2/Ngonyaka |
Incazelo Yomkhiqizo
PCBA Projects Isingeniso
Inkampani ye-ABIS CIRCUITS iletha izinsiza, hhayi imikhiqizo kuphela.Sinikeza izixazululo, hhayi izimpahla kuphela.
Kusukela ekukhiqizweni kwe-PCB, izakhi ezithengwayo kuya ezingxenyeni ziyahlangana.Kufaka phakathi:
- PCB Custom
- Umdwebo / umklamo we-PCB ngokuya ngomdwebo wakho wohlelo
- Ukukhiqizwa kwe-PCB
- Ukuthola ingxenye
- PCB Hlanganisa
- PCBA 100% test
Izinzuzo Zethu
- Imishini Yokukhetha Nendawo esezingeni eliphezulu ekwazi ukucubungula izingxenye ze-SMD ezingaba ngu-25,000 ngehora.
- Ikhono eliphezulu lokuhlinzeka nge-60K Sqm ngenyanga-Inikeza ivolumu ephansi kanye nokukhiqizwa kwe-PCB okudingekayo, kanye nemikhiqizo emikhulu
- Onjiniyela bethimba lobunjiniyela abangama-40 kanye nendlu yabo yamathuluzi, eqinile kwa-OEM.Inikeza izinketho ezimbili ezilula: Ulwazi Olwezifiso kanye Olujwayelekile Olujulile lwe-IPC Class II kanye namazinga we-III
Sihlinzeka ngesevisi ye-EMS yokhiye wokuvula ebanzi kumakhasimende afuna sihlanganise i-PCB ku-PCBA, okuhlanganisa ama-prototypes, iphrojekthi ye-NPI, ivolumu encane nephakathi.Siyakwazi futhi ukuthola zonke izingxenye zephrojekthi yakho yomhlangano we-PCB.Onjiniyela bethu kanye nethimba lethu labafuna usizo banolwazi olucebile embonini ye-supply chain kanye ne-EMS, ngolwazi olujulile emhlanganweni we-SMT oluvumela ukuxazulula zonke izinkinga zokukhiqiza.Isevisi yethu iyonga, iyavumelana nezimo, futhi ithembekile.Sinelisile amakhasimende kuzo zonke izimboni eziningi ezihlanganisa ezokwelashwa, ezezimboni, ezezimoto kanye nezabathengi.
PCBA Amakhono
| 1 | Umhlangano we-SMT ohlanganisa umhlangano we-BGA |
| 2 | Ama-SMD chips amukelwayo: 0204, BGA, QFP, QFN, TSOP |
| 3 | Ubude bengxenye: 0.2-25mm |
| 4 | Ukupakisha okuncane: 0204 |
| 5 | Ibanga elincane phakathi kwe-BGA : 0.25-2.0mm |
| 6 | Ubuncane besayizi ye-BGA: 0.1-0.63mm |
| 7 | Isikhala esincane se-QFP: 0.35mm |
| 8 | Usayizi omncane womhlangano: (X*Y): 50*30mm |
| 9 | Usayizi womhlangano omkhulu: (X*Y): 350*550mm |
| 10 | Ukunemba kokukhetha indawo: ±0.01mm |
| 11 | Amandla okubeka: 0805, 0603, 0402 |
| 12 | Ukulingana kwe-pin count ephezulu kuyatholakala |
| 13 | Umthamo we-SMT ngosuku: amaphuzu angama-80,000 |
Amandla - SMT
| Imigqa | 9(5 Yamaha,4KME) |
| Amandla | 52 million ukufakwa ngenyanga |
| Usayizi Webhodi Eliphezulu | 457*356mm.(18”X14”) |
| Usayizi omncane wengxenye | 0201-54 sq.mm.(0.084 sq.inch),isixhumi eside,CSP,BGA,QFP |
| Isivinini | 0.15 isekhondi/chip,0.7 isekhondi/QFP |
Amandla - PTH
| Imigqa | 2 |
| Ububanzi bebhodi obukhulu | 400 mm |
| Uhlobo | Igagasi elikabili |
| Isimo se-Pbs | Ukwesekwa kolayini okungenamthofu |
| Izinga lokushisa eliphakeme | 399 degrees C |
| I-spray flux | Engeza |
| Ukushisa kwangaphambili | 3 |
Ikhwalithi yokulawula
| Ukuhlolwa kwe-AOI | Ihlola ama-solder pasteChecks wezinto ezifika ku-0201 Ihlola izingxenye ezingekho, i-offset, izingxenye ezingalungile, i-polarity |
| Ukuhlolwa kwe-X-Ray | I-X-Ray inikeza ukuhlolwa kokulungiswa okuphezulu:kwe-BGAs/ama-BGA amancane/amaphakheji esikali se-Chip/Amabhodi angenalutho |
| Ukuhlolwa Kwesekethe | Ukuhlolwa Kwesekethe kuvame ukusetshenziswa kanye ne-AOI kunciphisa ukukhubazeka okubangelwa izinkinga zezingxenye. |
| Ukuhlolwa kwamandla | I-Advanced Function TestFlash Device Programming Ukuhlola okusebenzayo |
- Ukuhlola okungenayo kwe-IOC
- Ukuhlolwa kokunamathisela kwe-solder ye-SPI
- Ukuhlolwa kwe-AOI okuku-inthanethi
- Ukuhlolwa kwesihloko sokuqala se-SMT
- Ukuhlola kwangaphandle
- Ukuhlolwa kwe-X-RAY-welding
- Ukusebenza kabusha kwedivayisi ye-BGA
- Ukuhlolwa kwe-QA
- I-Anti-static warehousing nokuthunyelwa
Isitifiketi
FAQ
Cha, asikwazi ukwamukela amafayela esithombe, uma ungenalo ifayela le-gerber, ungasithumela isampula ukuze silikopishe.
Inqubo Yekhophi ye-PCB&PCBA:
Izinga lokulethwa ngesikhathi lingaphezu kwama-95%
a), ukujika okusheshayo kwamahora angama-24 kwe-PCB eseceleni okukabili
b), 48hours for 4-8 izendlalelo prototype PCB
c), ihora elingu-1 lekhotheshini
d), amahora angu-2 ombuzo kanjiniyela/impendulo yesikhalazo
e), Amahora angu-7-24 wokusekelwa kobuchwepheshe/isevisi yoku-oda/imisebenzi yokukhiqiza
I-PCB ibhodi elinamathrekhi ethusi namaphedi axhuma izinto zikagesi.I-PCBA ibhekisela ekuhlanganisweni kwezingxenye ku-PCB ukuze kwakhiwe idivayisi ye-elekthronikhi esebenzayo.
Sukunamathisela okudala kusetshenziselwa ukubamba izakhi ze-elekthronikhi endaweni ngaphambi kokuthi zinamathiselwe unomphela ku-PCB ngesikhathi senqubo yokuphinda kufakwe i-solder.
| Amandla okukhiqiza wemikhiqizo edayiswayo eshisayo | |
| I-Double Side/Multilayer PCB Workshop | I-Aluminium PCB Workshop |
| Amandla Obuchwepheshe | Amandla Obuchwepheshe |
| Izinto ezisetshenziswayo: CEM-1, CEM-3, FR-4(High TG), Rogers, TELFON | Izinto ezisetshenziswayo: Isisekelo se-Aluminium, isisekelo sethusi |
| Isendlalelo: Isendlalelo esingu-1 kuye kwezingu-20 | Isendlalelo: Isendlalelo esingu-1 kanye Nezendlalelo ezi-2 |
| Ububanzi/isikhala somugqa omncane: 3mil/3mil(0.075mm/0.075mm) | Ububanzi/isikhala somugqa omncane: 4mil/4mil(0.1mm/0.1mm) |
| Usayizi we-Min.Hole: 0.1mm(imbobo yokubhoboza) | Okuncane.Usayizi wembobo: 12mil(0.3mm) |
| Ubukhulu.Usayizi webhodi: 1200mm* 600mm | Usayizi webhodi eliphezulu: 1200mm* 560mm(47in* 22in) |
| Ugqinsi lwebhodi eliqediwe: 0.2mm-6.0mm | Ugqinsi lwebhodi eliqediwe: 0.3 ~ 5mm |
| Ubukhulu be-foil yethusi: 18um~280um(0.5oz~8oz) | Ubukhulu be-foil yethusi: 35um~210um(1oz~6oz) |
| I-NPTH Hole Ukubekezelela: +/-0.075mm, PTH Ukubekezelela Imbobo: +/-0.05mm | Ukubekezelela isikhundla sembobo: +/-0.05mm |
| Ukubekezelela Kohlaka: +/-0.13mm | Ukubekezelela kohlaka lomzila: +/ 0.15mm;ukubekezelela kohlaka lokubhoboza:+/ 0.1mm |
| Indawo engaphezulu iqediwe: I-HASL engenamthofu, igolide lokucwiliswa (ENIG), isiliva lokucwiliswa, i-OSP, ucwecwe lwegolide, umunwe wegolide, I-Carbon INK. | Ubuso buqediwe: I-HASL yamahhala yokuhola, igolide lokucwiliswa (ENIG), isiliva lokucwiliswa, i-OSP njll |
| Ukubekezelelwa kokulawulwa kokuphazamiseka: +/-10% | Hlala ukubekezelela ukujiya: +/-0.1mm |
| Amandla okukhiqiza: 50,000 sqm/ngenyanga | I-MC PCB Amandla okukhiqiza: 10,000 sqm/ngenyanga |
Izinqubo Zethu Zokuqinisekisa Ikhwalithi njengoba ngezansi:
a), Ukuhlola Okubonwayo
b),I-Flying probe, ithuluzi lokulungisa
c), Ukulawulwa kokuphazamiseka
d), ukutholwa kwekhono le-Solder
e), Isibonakhulu se-Metallogricic Digital
f), AOI(Ukuhlola Okuzenzakalelayo Okuzenzakalelayo)
Ibhilidi yezinto zokwakha (BOM) enemininingwane:
a),Mizinombolo zezingxenye ze-nufacturers,
b),Cinombolo yezingxenye zabahlinzeki (isb. Digi-key, Igundane, RS)
c), izithombe zesampula ze-PCBA uma kungenzeka.
d), Inani
I-ABIS ayinazo izidingo ze-MOQ ze-PCB noma i-PCBA.
| Amandla okukhiqiza wemikhiqizo edayiswayo eshisayo | |
| I-Double Side/Multilayer PCB Workshop | I-Aluminium PCB Workshop |
| Amandla Obuchwepheshe | Amandla Obuchwepheshe |
| Izinto ezisetshenziswayo: CEM-1, CEM-3, FR-4(High TG), Rogers, TELFON | Izinto ezisetshenziswayo: Isisekelo se-Aluminium, isisekelo sethusi |
| Isendlalelo: Isendlalelo esingu-1 kuye kwezingu-20 | Isendlalelo: Isendlalelo esingu-1 kanye Nezendlalelo ezi-2 |
| Ububanzi/isikhala somugqa omncane: 3mil/3mil(0.075mm/0.075mm) | Ububanzi/isikhala somugqa omncane: 4mil/4mil(0.1mm/0.1mm) |
| Usayizi we-Min.Hole: 0.1mm(imbobo yokubhoboza) | Okuncane.Usayizi wembobo: 12mil(0.3mm) |
| Ubukhulu.Usayizi webhodi: 1200mm* 600mm | Usayizi webhodi eliphezulu: 1200mm* 560mm(47in* 22in) |
| Ugqinsi lwebhodi eliqediwe: 0.2mm-6.0mm | Ugqinsi lwebhodi eliqediwe: 0.3 ~ 5mm |
| Ubukhulu be-foil yethusi: 18um~280um(0.5oz~8oz) | Ubukhulu be-foil yethusi: 35um~210um(1oz~6oz) |
| I-NPTH Hole Ukubekezelela: +/-0.075mm, PTH Ukubekezelela Imbobo: +/-0.05mm | Ukubekezelela isikhundla sembobo: +/-0.05mm |
| Ukubekezelela Kohlaka: +/-0.13mm | Ukubekezelela kohlaka lomzila: +/ 0.15mm;ukubekezelela kohlaka lokubhoboza:+/ 0.1mm |
| Indawo engaphezulu iqediwe: I-HASL engenamthofu, igolide lokucwiliswa (ENIG), isiliva lokucwiliswa, i-OSP, ucwecwe lwegolide, umunwe wegolide, I-Carbon INK. | Ubuso buqediwe: I-HASL yamahhala yokuhola, igolide lokucwiliswa (ENIG), isiliva lokucwiliswa, i-OSP njll |
| Ukubekezelelwa kokulawulwa kokuphazamiseka: +/-10% | Hlala ukubekezelela ukujiya: +/-0.1mm |
| Amandla okukhiqiza: 50,000 sqm/ngenyanga | I-MC PCB Amandla okukhiqiza: 10,000 sqm/ngenyanga |
·Nge-ABIS, amakhasimende ehlisa ngokuphawulekayo nangempumelelo izindleko zawo zokuthengwa kwempahla emhlabeni jikelele.Ngemuva kwesevisi ngayinye ehlinzekwa yi-ABIS, kufihlwe ukonga izindleko kumakhasimende.
.Sinezitolo ezimbili ezihlangene, esisodwa esohlobo lwe-prototype, ukujika okusheshayo, nokwenza umthamo omncane.Enye ngeyokukhiqiza ngobuningi futhi eyebhodi le-HDI, elinabasebenzi abanekhono eliphezulu, lemikhiqizo yekhwalithi ephezulu enamanani ancintisanayo kanye nokulethwa ngesikhathi.
.Sihlinzeka ngokuthengisa okuchwepheshile, ukwesekwa kwezobuchwepheshe nokuphathekayo, emhlabeni wonke ngamahora angama-24 empendulo yesikhalazo.
