Indawo engaphezulu ye-PCB (Printed Circuit Board) ibhekisela ohlotsheni lwe-coating noma ukwelashwa okusetshenziselwa iminonjana yethusi eveziwe namaphedi endaweni yebhodi.Ukuqedwa komphezulu kufeza izinjongo ezimbalwa, okuhlanganisa ukuvikela ithusi eliveziwe ekufakweni kwe-oxidation, ukwenza ngcono ukubola, nokuhlinzeka indawo eyisicaba yokunamathisela ingxenye ngesikhathi sokuhlanganisa.Ukuqedwa kwendawo okuhlukile kunikeza amazinga ahlukene okusebenza, izindleko, nokuhambisana nezinhlelo zokusebenza ezithile.
Igolide-plating kanye nokucwiliswa igolide yizinqubo ezivame ukusetshenziswa ekukhiqizeni ibhodi lesifunda yesimanje.Ngokuhlanganiswa okwandayo kwama-IC kanye nenani elikhulayo lezikhonkwane, inqubo yokufafaza i-solder eqondile idonsa kanzima ukuze ifake amaphedi amancane e-solder, okwenza izinselele zokuhlanganisa i-SMT.Ukwengeza, isikhathi seshalofu samapuleti kathayela afuthwe sifushane.Izinqubo zegolide zokucwenga noma ukucwiliswa kwegolide zinikeza izixazululo kulezi zinkinga.
Kubuchwepheshe be-surface mount, ikakhulukazi ezingxenyeni ezincane kakhulu ezifana no-0603 kanye no-0402, ukuvuleka kwamaphedi e-solder kuthinta ngokuqondile ikhwalithi yokuphrinta ye-solder paste, yona ibe nomthelela omkhulu kwikhwalithi yokuphinda kufakwe kabusha i-solder.Ngakho-ke, ukusetshenziswa kwe-fullboard gold-plating noma igolide lokucwiliswa kuvame ukubonwa kuzinqubo zokukhweza eziphakeme kakhulu nezincane kakhulu.
Phakathi nesigaba sokukhiqiza isilingo, ngenxa yezici ezifana nokuthengwa kwengxenye, amabhodi ngokuvamile awathengiswa ngokushesha lapho efika.Kunalokho, zingalinda amasonto noma ngisho izinyanga ngaphambi kokuba zisetshenziswe.Impilo yeshelufu yamabhodi egolide anegolide kanye nokucwiliswa yinde kakhulu kunaleyo yamabhodi anamathayela.Ngenxa yalokho, lezi zinqubo ziyakhethwa.Izindleko zama-PCB egolide agqitshwe ngegolide kanye nokucwiliswa phakathi nesiteji sokusampula ziqhathaniswa nalezo zamabhodi we-lead-tin alloy board.
1. Electroless Nickel Immersion Gold (ENIG): Lena indlela evamile yokwelashwa kwe-PCB surface.Kuhilela ukusebenzisa ungqimba lwe-nickel engenawo amandla njengongqimba oluphakathi kumaphedi e-solder, okulandelwa ungqimba lwegolide lokucwiliswa endaweni ye-nickel.I-ENIG inikezela ngezinzuzo ezifana nokuthengiselana okuhle, ukucaba, ukumelana nokugqwala, nokusebenza kahle kwe-solderability.Izici zegolide nazo ziyasiza ekuvimbeleni i-oxidation, ngaleyo ndlela ithuthukise ukuqina kwesitoreji sesikhathi eside.
2. I-Hot Air Solder Leveling (HASL): Lena enye indlela evamile yokwelashwa kwendawo.Enqubweni ye-HASL, amaphedi e-solder acwiliswa ku-alloy tin encibilikisiwe futhi i-solder eyeqile ishaywa umoya oshisayo, ishiya ungqimba lwe-solder olufanayo.Izinzuzo ze-HASL zifaka phakathi izindleko eziphansi, ukwenza lula kanye nokusoda, nakuba ukunemba kwayo kanye nokucaba kwayo kungase kube phansi uma kuqhathaniswa.
3. Electroplating Gold: Le ndlela ihlanganisa electroplating ungqimba lwegolide electroplating pads solder.Igolide lihamba phambili ekuqhubekiseni ugesi kanye nokungagqwali, ngaleyo ndlela kuthuthukiswe ikhwalithi ye-soldering.Kodwa-ke, ukucwenga kwegolide kuvame ukubiza kakhulu uma kuqhathaniswa nezinye izindlela.Isetshenziswa ikakhulukazi ekufakweni komunwe wegolide.
4. I-Organic Solderability Preservatives (OSP): I-OSP ihlanganisa ukusebenzisa ungqimba oluvikelayo lwemvelo kumaphedi e-solder ukuwavikela ekushiseni.I-OSP inikeza ukucaba okuhle, ukuthengiselana, futhi ifanele ukusetshenziswa komsebenzi wokukhanya.
5. Ithini Lokucwiliswa: Ngokufanayo negolide lokucwiliswa, ithini lokucwiliswa lihlanganisa ukumboza ama-solder ngongqimba lukathayela.Ithini lokucwiliswa lihlinzeka ngokusebenza okuhle kokusoda futhi kubiza kakhulu uma kuqhathaniswa nezinye izindlela.Kodwa-ke, ingahle ingabi ngaphezu kwegolide lokucwiliswa ngokuya ngokumelana nokugqwala kanye nokuzinza kwesikhathi eside.
6. I-Nickel/Gold Plating: Le ndlela ifana negolide lokucwiliswa, kodwa ngemva kwe-electroless nickel plating, ungqimba lwethusi lumbozwa kulandelwa ukwelashwa kwe-metalization.Le ndlela inikeza i-conductivity enhle kanye nokumelana nokugqwala, okulungele izicelo zokusebenza okuphezulu.
7. I-Silver Plating: I-Silver plating ihlanganisa ukumboza ama-solder pads ngongqimba lwesiliva.Isiliva lihle kakhulu ngokuya nge-conductivity, kodwa lingase likhiphe i-oxidize lapho livezwe emoyeni, ngokuvamile lidinga isendlalelo esingeziwe sokuvikela.
8. I-Hard Gold Plating: Le ndlela isetshenziselwa izixhumi noma izindawo zokuxhumana zesokhethi ezidinga ukufakwa nokususwa njalo.Kusetshenziswa ungqimba olujiyile lwegolide ukuze kuhlinzekwe ukumelana nokugqwala kanye nokusebenza kokugqwala.
Umehluko phakathi kwe-Gold-Plating ne-Immersion Gold:
1. Isakhiwo sekristalu esakhiwe ngegolide-plating kanye nokucwiliswa kwegolide sihlukile.Igolide-plating inesendlalelo segolide esincanyana uma kuqhathaniswa negolide lokucwiliswa.Ukucwecwa kwegolide kuvame ukubaphuzi kakhulu kunegolide lokucwiliswa, okuyinto amakhasimende ayithola inelisa kakhulu.
2. Igolide lokucwiliswa linezici zokusoda ezingcono kakhulu uma kuqhathaniswa nokufakwa kwegolide, ukwehlisa ukonakala kwe-soldering kanye nezikhalazo zamakhasimende.Amabhodi egolide okucwiliswa anengcindezi elawulekayo futhi afaneleka kakhulu izinqubo zokubopha.Kodwa-ke, ngenxa yemvelo yayo ethambile, igolide lokucwiliswa alikwazi ukuhlala isikhathi eside eminwe yegolide.
3. Ukucwiliswa kwegolide kugqokisa kuphela i-nickel-golide kumaphedi e-solder, akuthinti ukudluliswa kwesignali ngezendlalelo zethusi, kanti ukufakwa kwegolide kungase kube nomthelela ekudlulisweni kwesignali.
4. I-hard gold plating inokwakheka kwekristalu elicinene uma kuqhathaniswa negolide elicwilisiwe, okuyenza ingangenwa kalula yi-oxidation.Igolide elicwilisiwe linongqimba lwegolide oluncanyana, olungavumela i-nickel ukuthi isakazeke ngaphandle.
5. Ukucwiliswa kwegolide mancane amathuba okuba kubangele amasekhethi amafushane ezintambo kumadizayini aminyana kakhulu uma kuqhathaniswa nokucwecwa kwegolide.
6. Igolide lokucwiliswa linokunamathela okungcono phakathi kokumelana ne-solder nezendlalelo zethusi, okungathinti isikhala phakathi nezinqubo eziyisinxephezelo.
7. Igolide lokucwiliswa livame ukusetshenziselwa amabhodi adingeka kakhulu ngenxa yokucaba kwawo okungcono.Igolide-plating ngokuvamile igwema okwenzeka ngemva kokuhlanganiswa kwephedi elimnyama.Ubucaba nempilo yeshelufu yamabhodi egolide okucwiliswa kuhle njengalawo ocwecwe lwegolide.
Ukukhetha indlela yokwelapha engaphezulu efanele kudinga ukucabangela izici ezifana nokusebenza kukagesi, ukumelana nokugqwala, izindleko, kanye nezidingo zohlelo lokusebenza.Kuye ngezimo ezithile, izinqubo ezifanele zokwelashwa kwendawo zingakhethwa ukuze zihlangabezane nenqubo yokuklama.
Isikhathi sokuthumela: Aug-18-2023
