Imboni ye-PCB (Printed Circuit Board) iwumkhakha wobuchwepheshe obuthuthukile, ukusungula izinto ezintsha, nobunjiniyela obunembayo.Kodwa-ke, iphinde iza nolimi lwayo oluhlukile olugcwele izifinyezo eziyimfihlo nama-akhronimi.Ukuqonda lezi zifinyezo zemboni ye-PCB kubalulekile kunoma ubani osebenza kulo mkhakha, kusukela konjiniyela nabaklami kuya kubakhiqizi nabahlinzeki.Kulo mhlahlandlela obanzi, sizonquma izifinyezo ezibalulekile ezingu-60 ezivame ukusetshenziswa embonini ye-PCB, sikhanyisele izincazelo ezingemuva kwezinhlamvu.
**1.I-PCB – Ibhodi Lesifunda Eliphrintiwe**:
Isisekelo semishini ye-elekthronikhi, sinikeza inkundla yokufaka nokuxhuma izingxenye.
**2.I-SMT – I-Surface Mount Technology**:
Indlela yokunamathisela izingxenye ze-elekthronikhi ngqo endaweni ye-PCB.
**3.I-DFM – Idizayini Yokukhiqiza**:
Imihlahlandlela yokuklama ama-PCB ngokukhululeka kokukhiqiza engqondweni.
**4.I-DFT – Idizayini Yokuhlola**:
Izimiso zedizayini zokuhlola okusebenzayo nokutholwa kwamaphutha.
**5.I-EDA – I-Electronic Design Automation**:
Amathuluzi esoftware okwakhiwa kwesekethe ye-elekthronikhi kanye nesakhiwo se-PCB.
**6.I-BOM - Umthethosivivinywa Wezinto Zokusebenza**:
Uhlu olubanzi lwezingxenye nezinto ezidingekayo zokuhlanganisa i-PCB.
**7.I-SMD - Idivayisi Ye-Surface Mount**:
Izingxenye eziklanyelwe ukuhlanganiswa kwe-SMT, ezinemikhondo eyisicaba noma amaphedi.
**8.I-PWB – Ibhodi Lezintambo Eziphrintiwe**:
Igama ngezinye izikhathi elisetshenziswa ngokushintshana ne-PCB, ngokuvamile kumabhodi alula.
**9.FPC – Flexible Printed Circuit**:
Ama-PCB enziwe ngezinto eziguquguqukayo zokugoba nokuvumelana nezindawo ezingahleliwe.
**10.I-Rigid-Flex PCB**:
Ama-PCB ahlanganisa izakhi eziqinile nezivumelana nezimo ebhodini elilodwa.
**11.I-PTH - Ifakwe Ngembobo**:
Izimbobo kuma-PCB ane-conductive plating ye-solder yengxenye yembobo.
**12.I-NC – Ukulawulwa Kwezinombolo**:
Ukukhiqiza okulawulwa ngekhompuyutha kokwenziwa kwe-PCB okunembayo.
**13.I-CAM – Ukukhiqiza Okusizwa Yikhompyutha**:
Amathuluzi esofthiwe okukhiqiza idatha yokukhiqiza yokukhiqizwa kwe-PCB.
**14.I-EMI – Ukuphazanyiswa kwe-Electromagnetic**:
Imisebe ye-electromagnetic engadingeki engaphazamisa izinto zikagesi.
**15.I-NRE – Ubunjiniyela obungaphindi**:
Izindleko zesikhathi esisodwa zokuthuthukiswa kwedizayini ye-PCB yangokwezifiso, okuhlanganisa nezinkokhelo zokusetha.
**16.UL - Underwriters Laboratories**:
Iqinisekisa ama-PCB ukuze ahlangabezane namazinga athile okuphepha nokusebenza.
**17.I-RoHS - Umkhawulo Wezinto Eziyingozi**:
Umyalelo olawula ukusetshenziswa kwezinto eziyingozi kuma-PCB.
**18.I-IPC – Isikhungo Sokuxhumanisa Nokupakishwa Kweziyingi Ze-elekthronikhi**:
Isungula amazinga embonini wokuklama nokukhiqiza kwe-PCB.
**19.I-AOI – Ukuhlola Okuzenzakalelayo Okuzenzakalelayo**:
Ukulawulwa kwekhwalithi kusetshenziswa amakhamera ukuhlola ama-PCB uma kunesici.
**20.I-BGA – I-Ball Grid Array**:
Iphakethe le-SMD elinamabhola e-solder ngaphansi ukuze kuxhunywe ukuminyana okuphezulu.
**21.I-CTE – I-Coefficient of Thermal Expansion**:
Isilinganiso sokuthi izinto ezisetshenziswayo zinwetshwa kanjani noma zivumelana nokushintsha kwezinga lokushisa.
**22.I-OSP – I-Organic Solderability Preservative**:
Ungqimba oluncane lwemvelo olusetshenziswa ukuvikela imikhondo yethusi eveziwe.
**23.I-DRC - Ukuhlola Umthetho Womklamo**:
Ukuhlola okuzenzakalelayo ukuze kuqinisekiswe ukuthi idizayini ye-PCB ihlangabezana nezidingo zokukhiqiza.
**24.I-VIA – I-Vertical Interconnect Access**:
Izimbobo ezisetshenziselwa ukuxhuma izingqimba ezihlukene ze-PCB yezendlalelo eziningi.
**25.I-DIP – Iphakheji Ekabili Emgqeni**:
Ingxenye yembobo enemigqa emibili ehambisanayo yokuhola.
**26.I-DDR - Isilinganiso Sedatha Ekabili**:
Ubuchwepheshe bememori obudlulisela idatha kuzo zombili iziphetho ezikhuphukayo neziwayo zesignali yewashi.
**27.I-CAD – Idizayini Esizwa Ngekhompyutha**:
Amathuluzi esofthiwe omklamo we-PCB nesakhiwo.
**28.I-LED – Light Emitting Diode**:
Idivayisi ye-semiconductor ekhipha ukukhanya lapho umsinga kagesi udlula kuyo.
**29.I-MCU - Iyunithi ye-Microcontroller**:
Isekethe ehlanganisiwe ehlangene equkethe iphrosesa, inkumbulo, nama-peripherals.
**30.ESD – Electrostatic Discharge**:
Ukugeleza kukagesi kungazelelwe phakathi kwezinto ezimbili ezinamashaji ahlukene.
**31.I-PPE – Izinto Zokuzivikela Zomuntu Siqu**:
Izimpahla zokuphepha ezifana namagilavu, izibuko, namasudi agqokwa abasebenzi abakhiqiza i-PCB.
**32.I-QA – Isiqiniseko Sekhwalithi**:
Izinqubo nezinqubo zokuqinisekisa ikhwalithi yomkhiqizo.
**33.I-CAD/CAM – Idizayini Esizwa Ikhompyutha/Ukukhiqiza Okusizwa Ngekhompyutha**:
Ukuhlanganiswa kokuklama kanye nezinqubo zokukhiqiza.
**34.I-LGA – Land Grid Array**:
Iphakheji enoxhaxha lwamaphedi kodwa engenawo umkhondo.
**35.I-SMTA – Surface Mount Technology Association**:
Inhlangano ezinikele ekuthuthukiseni ulwazi lwe-SMT.
**36.I-HASL - I-Hot Air Solder Leveling**:
Inqubo yokusebenzisa i-solder coating ezindaweni ze-PCB.
**37.I-ESL - I-Equivalent Series Inductance**:
Ipharamitha emele i-inductance ku-capacitor.
**38.I-ESR – Equivalent Series Resistance**:
Ipharamitha emele ukulahlekelwa okuphikisayo ku-capacitor.
**39.I-THT – Ubuchwepheshe Bembobo**:
Indlela yokukhweza izingxenye ezinomkhondo odlula emigodini ku-PCB.
**40.I-OSP - Isikhathi Sokuphuma Kwesevisi**:
Isikhathi lapho i-PCB noma idivayisi ingasebenzi.
**41.I-RF - I-Radio Frequency**:
Amasignali noma izingxenye ezisebenza kumafrikhwensi aphezulu.
**42.I-DSP – Iphrosesa Yesiginali Yedijithali**:
I-microprocessor ekhethekile eyenzelwe imisebenzi yokucubungula isignali yedijithali.
**43.I-CAD – Idivaysi Enamathiselwe Yengxenye**:
Umshini osetshenziselwa ukubeka izingxenye ze-SMT kuma-PCB.
**44.I-QFP - Iphakheji Ye-Quad Flat**:
Iphakheji ye-SMD enezinhlangothi ezine eziyisicaba futhi ihola ohlangothini ngalunye.
**45.I-NFC – Near Field Communication**:
Ubuchwepheshe bokuxhumana okungenantambo ebangeni elifushane.
**46.I-RFQ - Isicelo Sekhotheshini**:
Idokhumenti ecela amanani nemigomo kumkhiqizi we-PCB.
** 47.I-EDA – I-Electronic Design Automation**:
Itemu kwesinye isikhathi lisetshenziselwa ukubhekisa kulo lonke uhlelo lwesoftware ye-PCB design.
**48.I-CEM – Umkhiqizi Wenkontileka Yezogesi**:
Inkampani egxile ekuhlanganiseni nasekukhiqizeni i-PCB.
**49.I-EMI/RFI – Ukuphazanyiswa kwe-Electromagnetic/I-Radio-Frequency Interference**:
Imisebe ye-electromagnetic engadingeki engaphazamisa izinto zikagesi kanye nokuxhumana.
**50.I-RMA - Buyisela Ukugunyazwa Kwempahla**:
Inqubo yokubuyisela nokushintsha izingxenye ze-PCB ezingalungile.
**51.I-UV - I-Ultraviolet**:
Uhlobo lwemisebe esetshenziswa ekwelapheni kwe-PCB nasekucubunguleni imaski ye-solder ye-PCB.
**52.I-PPE - Unjiniyela Wepharamitha Yenqubo**:
Uchwepheshe olungiselela izinqubo zokukhiqiza ze-PCB.
**53.TDR – Time Domain Reflectometry**:
Ithuluzi lokuxilonga lokukala izici zomugqa wokudlulisela kuma-PCB.
**54.ESR – Electrostatic Resistivity**:
Isilinganiso sekhono lempahla lokuhlakaza ugesi omile.
**55.I-HASL - I-Horizontal Air Solder Leveling**:
Indlela yokusebenzisa i-solder coating ezindaweni ze-PCB.
**56.IPC-A-610**:
Izinga lemboni lemibandela yokwamukelwa kokuhlanganiswa kwe-PCB.
**57.I-BOM - Ukwakhiwa Kwezinto Ezisetshenziswayo**:
Uhlu lwezinto kanye nezingxenye ezidingekayo ukuze kuhlanganiswe i-PCB.
**58.I-RFQ - Isicelo Sekhotheshini**:
Idokhumenti esemthethweni ecela izingcaphuno kubahlinzeki be-PCB.
**59.I-HAL - I-Hot Air Leveling**:
Inqubo yokuthuthukisa ukuthengiselana kwezindawo zethusi kuma-PCB.
**60.I-ROI - Buyela Kutshalomali**:
Isilinganiso senzuzo yezinqubo zokukhiqiza ze-PCB.
Manje njengoba usuvule ikhodi ngemuva kwalezi zifinyezo ezingu-60 ezibalulekile embonini ye-PCB, ukuhlomele kangcono ukuzulazula kule nkambu eyinkimbinkimbi.Kungakhathaliseki ukuthi uchwepheshe onolwazi olunzulu noma usanda kuqala uhambo lwakho ekwakhiweni nasekukhiqizeni i-PCB, ukuqonda lawa ma-akhronimi kuyisihluthulelo sokuxhumana okuphumelelayo nempumelelo emhlabeni Wamabhodi Esifunda Aphrintiwe.Lezi zifinyezo ziwulimi lokusungula
Isikhathi sokuthumela: Sep-20-2023
