Ibhodi ye-PCB Yezingqimba ezi-6 engenziwa ngendlela oyifisayo ene-3.0oz Copper kanye ne-ENIG 2u” Surface Finish
Ulwazi Oluyisisekelo
| Imodeli No. | I-PCB-A35 |
| Iphakethe lezokuthutha | Ukupakisha Vacuum |
| Isitifiketi | UL, ISO9001&ISO14001,RoHS |
| Izincazelo | IPC Ikilasi 2 |
| Ubuncane beSikhala/Ulayini | 0.075mm/3mil |
| Ukulawulwa kwe-impedance | 50±10% |
| Amandla Okukhiqiza | 720, 000 M2/Ngonyaka |
| Umsuka | Kwenziwe eshayina |
Incazelo Yomkhiqizo
Uhlolojikelele lwamabhodi wamasekhethi aphrintiwe aqinile
Incazelo yangempela yegama elithi "rigid-flex" ihlanganisa izinzuzo zawo womabili amabhodi aguquguqukayo naqinile.Kubonwa njengesekhethi ye-two-in-one ixhunywe ngezimbobo ezinamapulangwe.Amasekhethi aguquguqukayo aqinile anika amandla ukuminyana kwengxenye ephezulu ngenkathi elingana nezikhala ezinomumo olinganiselwe nezingajwayelekile.
Amabhodi esekethe ephrintiwe e-Rigid-flex aqukethe izendlalelo zangaphakathi zesekethe eguquguqukayo eziningi ezinamathiselwe ndawonye kusetshenziswa ifilimu ye-epoxy pre-preg bonding, efana nesekhethi ye-multilayer flexible.Amasekethe aguquguqukayo aqinile asetshenziswe embonini yezempi neye-aerospace iminyaka engaphezu kwengama-20.Emabhodini amaningi wesifunda aqinile.
Ezobuchwepheshe nekhono
| Into | Amandla Okukhiqiza |
| Izibalo Zesendlalelo | 1-32 |
| Okubalulekile | FR-4, High TG FR-4, PTFE, Aluminium Base, Cu base, Rogers, Teflon, njll. |
| Ubukhulu Usayizi | 600mm X1200mm |
| Ukubekezelela Kohlaka Lwebhodi | ±0.13mm |
| Ukujiya Kwebhodi | 0.20mm-8.00mm |
| Ukubekezelela Ukuqina(t≥0.8mm) | ±10% |
| Ukuqina kwe-Tolerancc(t<0.8mm) | ±0.1mm |
| I-Insulation Layer Thickncss | 0.075mm-5.00mm |
| Ubuncane Iine | 0.075mm |
| Ubuncane besikhala | 0.075mm |
| Out Layer Copper Ukuqina | 18um--350um |
| Ungqimba Lwangaphakathi Ukuqina Kwethusi | 17um--175um |
| Imbobo Yokubhoboza(Mechanical) | 0.15mm-6.35mm |
| Qedela Imbobo(Mechanical) | 0.10mm-6.30mm |
| Ukubekezelela Idayamitha(Mechanical) | 0.05mm |
| Ukubhalisa(Okomshini) | 0.075mm |
| Isilinganiso se-Aspecl | 16:01 |
| Uhlobo Lwemaski Solder | I-LPI |
| I-SMT Mini.Solder Mask Width | 0.075mm |
| I-Mini.Solder Mask Clearance | 0.05mm |
| I-Plug Hole Diameter | 0.25mm--0.60mm |
| Ukubekezelelana Kokulawulwa Kwe-Impedans | 10% |
| I-Surface Qeda | I-HASL/HASL-LF, i-ENIG, i-Immersion Tin/Silver, i-Flash Gold, i-OSP, umunwe wegolide, i-Hard Gold |
Amandla Okukhiqiza-(Flex)
| izinto | iyunithi | ||||||
| Izendlalelo eziphezulu | Isendlalelo | 10 | |||||
| I-Base Material (Polymide) | μm | 9, 12, 18, 35, 70 | |||||
| I-copper foil | μm | 18,35,70 | |||||
| Isembozo (Polymide) | μm | 27.5, 37.5, 50, 75 | |||||
| I-Thermosetting Cement | μm | 13, 25 | |||||
| Usayizi Wephaneli enkulu | mm | 250*800 | 250*1500 ngezingqimba eziyi-10 | ||||
| Ubuncane Bephaneli Usayizi | mm | Kuya ngekhasimende | |||||
| Ubukhulu Ibhodi Eliqediwe Ukujiya | mm | 0.7 | |||||
| Ubuncane Bebhodi Eliqediwe Ukujiya | mm | 0.057mm | |||||
| Ubukhulu bomgodi Ukubekezelelana | mm | ±0.05mm | |||||
| Okungenani Ngembobo | mm | 0.1mm | |||||
| Okungenani Nge-Hole Pad | mm | 0.3mm | 0.25mm Ngokukhethekile | ||||
| Maximal Base Ukuqina Kwethusi | OZ | 2 | |||||
| Ubuncane Besisekelo Sokuqina Kwethusi | OZ | 1/4 | |||||
| Ukuqina Kwe-Copper Plating | μm | 8-20 | |||||
| Ukuqina Kwethusi kwe-PTH | μm | 8~20 | |||||
| Ubuncane Bobubanzi/Isikhala Solayini | mm | 0.05 | |||||
| Ubuso Buqediwe | / | Ngi, Au, Sn | |||||
I-Flexible PCB Lead Time
| Iqoqo elincaneIvolumu ≤1 imitha-skwele | Izinsuku Zokusebenza | Ukukhiqiza Okuningi | Izinsuku Zokusebenza |
| Uhlangothi Olulodwa | 3-4 | Uhlangothi Olulodwa | 8-10 |
| 2-4 izingqimba | 4-5 | 2-4 izingqimba | 10-12 |
| 6-8 izingqimba | 10-12 | 6-8 izingqimba | 14-18 |
Izinzuzo ze-ABIS
- Imishini esezingeni eliphezulu enesivinini esiphezulu Imishini Yokukhetha Nendawo ekwazi ukucubungula izingxenye ze-SMD ezingaba ngu-25,000 ngehora.
- Ikhono eliphezulu lokuhlinzeka nge-60K Sqm ngenyanga-Inikeza ivolumu ephansi kanye nokukhiqizwa kwe-PCB okudingekayo, kanye nokukhiqizwa okukhulu.
- Onjiniyela bethimba lobunjiniyela abangama-40 kanye nendlu yabo yamathuluzi, eqinile kwa-OEM.Inikeza izinketho ezimbili ezilula: Ulwazi Olwezifiso kanye Olujwayelekile Olujulile lwe-IPC Class II kanye namazinga we-III
Sihlinzeka ngesevisi ye-EMS yokhiye wokuvula ebanzi kumakhasimende afuna sihlanganise i-PCB ku-PCBA, okuhlanganisa ama-prototypes, amaphrojekthi we-NPI, amavolumu amancane naphakathi.Siyakwazi futhi ukuthola zonke izingxenye zephrojekthi yakho yomhlangano we-PCB.Onjiniyela bethu nethimba labafuna usizo banolwazi olucebile embonini ye-supply chain kanye ne-EMS, ngolwazi olujulile emhlanganweni we-SMT olusivumela ukuthi sixazulule zonke izinkinga zokukhiqiza.Isevisi yethu iyonga, iyavumelana nezimo, futhi ithembekile.Sinelisile amakhasimende kuzo zonke izimboni eziningi ezihlanganisa ezokwelashwa, ezezimboni, ezezimoto, kanye nogesi wabathengi.
Isitifiketi
FAQ
Izimboni Eziyinhloko ze-ABIS: Ukulawulwa Kwezimboni, Ezokuxhumana, Imikhiqizo Yezimoto kanye Nezokwelapha.Imakethe Eyinhloko ye-ABIS: 90% Imakethe Yamazwe Ngamazwe (40% -50% yase-USA, 35% yase-Europe, 5% yaseRussia kanye ne-5% -10% yaseMpumalanga Asia) kanye ne-10% Yemakethe Yasekhaya.
Abahlinzeki abakhulu(FR4): Kingboard (Hong Kong), NanYa (Taiwan), kanye ne-Shengyi (China), Uma abanye, sicela i-RFQ.
Izinqubo Zethu Zokuqinisekisa Ikhwalithi njengoba ngezansi:
a), Ukuhlola Okubonwayo
b), I-Flying probe, ithuluzi lokulungisa
c), Ukulawulwa kokuphazamiseka
d), ukutholwa kwekhono le-Solder
e), Isibonakhulu se-Metallogricic Digital
f), i-AOI (Ukuhlola okuzenzakalelayo kokubona)
Ngokuvamile izinsuku ezingu-2-3 zokwenza isampula.Isikhathi sokuhola sokukhiqiza ngobuningi sizoncika enanini le-oda kanye nesizini ofaka ngayo i-oda.
Izinqubo Zethu Zokuqinisekisa Ikhwalithi njengoba ngezansi:
a), Ukuhlola Okubonwayo
b), I-Flying probe, ithuluzi lokulungisa
c), Ukulawulwa kokuphazamiseka
d), ukutholwa kwekhono le-Solder
e), Isibonakhulu se-Metallogricic Digital
f), i-AOI (Ukuhlola okuzenzakalelayo kokubona)
I-ABlS yenza ukuhlola okubonwayo kanye ne-AOl okungu-100% kanye nokuhlola ugesi, ukuhlola amandla kagesi aphezulu, ukuhlola i-impedancecontrol, i-micro-sectioning, ukuhlola ukushaqeka kwe-thermal, ukuhlola i-solder, ukuhlola ukwethembeka, ukuhlola ukumelana nokuvikela., ukuhlolwa kwe-ionic ukuhlanzekakanye nokuhlolwa okusebenzayo kwe-PCBA.
I-ABlS yenza ukuhlola okubonwayo kanye ne-AOl okungu-100% kanye nokwenza ukuhlola kukagesi, ukuhlola amandla kagesi aphezulu, ukuhlola isilawuli se-impedance, ukuhlukanisa izingxenye ezincane, ukuhlola ukushaqeka kwe-thermal, ukuhlola i-solder, ukuhlola ukwethembeka, ukuhlola ukumelana nokuvikela, ukuhlola ukuhlanzeka kwe-ionic kanye nokuhlola okusebenzayo kwe-PCBA.
I-ABIS ayinazo izidingo ze-MOQ ze-PCB noma i-PCBA.
Izinga lokulethwa ngesikhathi lingaphezu kwama-95%
a), ukujika okusheshayo kwamahora angama-24 kwe-PCB eseceleni okukabili
b), amahora angu-48 wezendlalelo ezingu-4-8 sibonelo se-PCB
c), ihora elingu-1 lekhotheshini
d), amahora ama-2 ombuzo kanjiniyela/Impendulo yesikhalazo
e), amahora angama-7-24 okusekelwa kobuchwepheshe/isevisi yoku-oda/ukusebenza kokukhiqiza
