Iyini i-Steel Stencil ye-PCB SMT?

Ngohlelo lwePCBukukhiqiza, ukukhiqizwa kweI-Steel Stencil (eyaziwa nangokuthi "i-stencil")Kwenziwa ukuze kufakwe ngokunembile ukunamathisela kwe-solder kungqimba yokunamathisela ye-solder ye-PCB.Isendlalelo sokunamathisela i-solder, esibuye sibizwe ngokuthi "ungqimba lwemaski yokunamathisela," luyingxenye yefayela lokuklama le-PCB elisetshenziselwa ukuchaza izikhundla nokumaunamathisele solder.Lesi sendlalelo sibonakala ngaphambi kwe-i-surface Mount technology (SMT)izingxenye zidayiswa ku-PCB, okubonisa lapho i-solder paste idinga ukubekwa khona.Ngesikhathi se-soldering, i-stencil yensimbi ivala isendlalelo sokunamathisela i-solder, futhi i-solder paste isetshenziswa ngokunembile kuma-PCB pads ngokusebenzisa izimbobo ze-stencil, iqinisekisa ukuhlanganisa okunembile ngesikhathi senqubo yokuhlanganisa ingxenye elandelayo.

Ngakho-ke, i-solder paste layer iyisici esibalulekile ekukhiqizeni i-stencil yensimbi.Ezigabeni zokuqala zokukhiqiza i-PCB, ulwazi mayelana nesendlalelo sokunamathisela i-solder sithunyelwa kumkhiqizi we-PCB, okhiqiza i-stencil yensimbi ehambisanayo ukuze aqinisekise ukunemba nokuthembeka kwenqubo yokuhlanganisa.

Ekwakhiweni kwe-PCB (Printed Circuit Board), "i-pastemask" (eyaziwa nangokuthi "imaski yokunamathisela ethengiswayo" noma nje "imaski ye-solder") iyisendlalelo esibalulekile.Idlala indima ebalulekile enqubweni ye-soldering yokuhlanganisaamadivaysi okukhweza phezulu (ama-SMD).

Umsebenzi we-stencil yensimbi ukuvimbela ukunamathisela kwe-solder ukuthi kusetshenziswe ezindaweni lapho i-soldering akufanele yenzeke lapho i-soldering izingxenye ze-SMD.I-solder paste yinto esetshenziselwa ukuxhuma izingxenye ze-SMD kumaphedi e-PCB, futhi isendlalelo se-pastemask sisebenza "njengesithiyo" sokuqinisekisa ukuthi unamathisele we-solder usetshenziswa kuphela ezindaweni ezithile zokunamathisela.

Idizayini yesendlalelo se-pastemask ibaluleke kakhulu kunqubo yokukhiqiza ye-PCB njengoba ithonya ngokuqondile ikhwalithi yokudayiswa kanye nokusebenza okuphelele kwezingxenye ze-SMD.Ngesikhathi sokuklama kwe-PCB, abaklami badinga ukucabangela ngokucophelela ukwakheka kwesendlalelo se-pastemask, baqinisekise ukuqondana kwayo nezinye izendlalelo, njengesendlalelo sephedi nesendlalelo sengxenye, ukuze kuqinisekiswe ukunemba nokuthembeka kwenqubo yokuhlanganisa.

Ukucaciswa Kwedizayini Yesendlalelo Semaski Somthengisi (Istencil Sensimbi) ku-PCB:

Ekwakhiweni nasekukhiqizeni i-PCB, ukucaciswa kwenqubo ye-Solder Mask Layer (eyaziwa nangokuthi i-Steel Stencil) ngokuvamile ichazwa ngamazinga emboni kanye nezidingo zomkhiqizi.Nazi ezinye izincazelo ezijwayelekile zedizayini ze-Solder Mask Layer:

1. I-IPC-SM-840C: Leli izinga le-Solder Mask Layer elisungulwe yi-IPC (Association Connecting Electronics Industries).Izinga lichaza ukusebenza, izici zomzimba, ukuqina, ukujiya, kanye nezimfuneko zokudayiswa kwemaski yesoda.

2. Umbala Nohlobo: Imaski ye-solder ingafika ngezinhlobo ezahlukene, njengeI-Hot Air Solder Leveling (HASL) or Electroless Nickel Immersion Gold(ENIG), futhi izinhlobo ezahlukene zingase zibe nezidingo ezihlukile zokucaciswa.

3. Ukumbozwa kwe-Solder Mask Layer: Isendlalelo semaski ye-solder kufanele simboze zonke izindawo ezidinga ukuthengiswa kwezingxenye, kuyilapho kuqinisekiswa ukuvikelwa okufanele kwezindawo okungafanele zithengiswe.Isendlalelo semaski ye-solder kufanele futhi sigweme ukumboza izindawo zokukhweza noma izimpawu zesikrini sikasilika.

4. Ukucaca kwe-Solder Mask Layer: Isendlalelo semaski ye-solder kufanele sibe nokucaca okuhle ukuze kuqinisekiswe ukubonakala okucacile kwemiphetho yama-solder pads futhi kuvimbele ukunamathisela kwe-solder ekuchichimeni ezindaweni ezingafuneki.

5. Ukujiya Kwesendlalelo Semaski Ethengiswayo: Ugqinsi longqimba lwemaski ye-solder kufanele luhambisane nezidingo ezijwayelekile, ngokuvamile phakathi kwebanga lamashumi amaningana ama-micrometer.

6. Ukugwenywa Kwephini: Ezinye izingxenye ezikhethekile noma izikhonkwane kungase kudingeke ukuthi zihlale ziveziwe kusendlalelo semaski ye-solder ukuze kuhlangatshezwane nezimfuneko ezithile zokunamathisela.Ezimweni ezinjalo, imininingwane ye-solder mask ingadinga ukugwema ukusetshenziswa kwe-solder mask kulezo zindawo ezithile.

 

Ukuhambisana nalokhu kucaciswa kubalulekile ukuze kuqinisekiswe ikhwalithi nokunemba kwesendlalelo semaski ye-solder, ngaleyo ndlela kuthuthukiswe izinga lempumelelo nokuthembeka kokukhiqizwa kwe-PCB.Ukwengeza, ukubambelela kulokhu kucaciswa kusiza ukuthuthukisa ukusebenza kwe-PCB futhi kuqinisekisa ukuhlangana okulungile nokuthengiswa kwezingxenye ze-SMD.Ukusebenzisana nomkhiqizi nokulandela izindinganiso ezifanele phakathi nenqubo yokuklama kuyisinyathelo esibalulekile sokuqinisekisa ikhwalithi yongqimba lwe-stencil yensimbi.


Isikhathi sokuthumela: Aug-04-2023